Purpose of the Job
- To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.
Key Job Accountabilities:
- Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
- Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
- Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
- Track the consumption of critical components and suggest improvements for part lifetime extension.
- Maintain detailed logs of equipment history, repair procedures, and safety checklists.
Required Experience and Qualifications
- Bachelor's degree in Electrical, Electronic, Mechanical Engineering, or a related field.
- Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
- Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
- Comfort working in a cleanroom environment and flexibility for shift rotations.
