About GlobalFoundries
GlobalFoundries is a leading full‑service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most innovative technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries enables the technologies that transform industries and empower customers to shape their markets.
Role Summary
GlobalFoundries Singapore is seeking highly motivated Engineering WSDegree Interns to support Diffusion Process Engineering within a high‑volume, state‑of‑the‑art semiconductor manufacturing facility. This internship provides progressive exposure to thermal processing, dopant activation, and process control, culminating in a Final Year Project (FYP) aligned to real manufacturing and process challenges.
Key Responsibilities
Block 1: Foundational Learning & Exploration
- Learn semiconductor manufacturing fundamentals and wafer fabrication process flows
- Understand the role of diffusion and thermal processes in device fabrication and performance
- Learn basic concepts of dopant diffusion, oxidation, annealing, and thermal processing
- Understand cleanroom protocols, safety requirements, and factory operations
- Gain exposure to process control methodologies, quality systems, and manufacturing standards
- Become familiar with MES, fab operations, and engineering systems
- Job shadow Diffusion Process Engineers to understand daily engineering activities
Block 2: Process Analysis & Optimization
- Study diffusion process parameters and their impact on electrical performance, junction formation, and device reliability
- Perform data analysis to monitor process stability, variability, and trends
- Apply statistical tools (e.g., SPC) to detect excursions and support process improvement
- Support basic process troubleshooting and root cause analysis activities
Block 3 & Final Year Project (FYP): Engineer‑in‑Training Development
- Define FYP scope, objectives, and deliverables with an assigned industrial mentor
- Execute an FYP focused on diffusion or thermal process characterization, optimization, or improvement
- Conduct process capability studies and participate in DOE (Design of Experiments)
- Analyze data to support improvements in device performance, yield, reliability, or manufacturability
- Contribute to continuous improvement initiatives related to cost, quality, or productivity
- Complete the FYP under guidance of an assigned industrial mentor
Skills & Experience Gained
Technical Skills
- Understanding of diffusion and thermal process engineering fundamentals
- Knowledge of wafer fabrication flows, dopant behavior, and process variability
- Data analysis, SPC, and structured problem‑solving skills
Soft Skills
- Technical communication and presentation skills
- Collaboration within cross‑functional manufacturing and engineering teams
- Exposure to AI and Machine Learning concepts applied to process or manufacturing data
Practical Experience
- Hands‑on experience in a high‑volume semiconductor manufacturing environment
- Project ownership within a process engineering function
- Networking opportunities across engineering, manufacturing, and leadership teams
Required Qualifications
- Enrolled in a Mechanical, Electrical, Electronics, Materials, Chemical, or related Engineering degree
- Strong analytical, data‑driven, and problem‑solving skills
- Curious, detail‑oriented, and eager to learn
- Effective time management, communication, and teamwork skills
- Interest in semiconductor manufacturing and process engineering
Additional Information
- This requisition is exclusively for students enrolled in the WSDegree Programme (2026 intake)
- Internship period must be clearly stated in the CV, resume, or cover letter
