Engineering Project Manager - APTD Operations

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Project/Program Management:

• Lead technology development programs and projects to deliver against defined go-to-market timelines.

• Align program- and project-level plans, dependencies, and deliverables to ensure timely, cohesive execution.

• Develop and maintain integrated project schedules in collaboration with cross-functional teams.

• Ensure all deliverables and artifacts meet program requirements and align with established business processes.

• Proactively identify and resolve risks, issues, and roadblocks, escalate as needed to protect timelines.

• Facilitate regular project reviews and meetings to track progress and address challenges.

• Monitor and communicate project status and overall program health to stakeholders.

• Centralize and manage project documentation and data using SharePoint and Confluence.

• Continuously improve technology development processes, tools, and systems to drive execution efficiency.

Operations Management

• Handle technology development and engineering builds in partnership with internal and external teams.

• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.

• Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools.

• Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays.

• Supervise daily execution, including wafer offloading, kitting, and support of PWF and assembly builds.

• Identify, mitigate, and escalate risks, issues, and interdependencies to protect timelines and outcomes.

• Coordinate engineering builds and APTD operations in compliance with established standards and processes.

• Lead cross-functional improvement initiatives and build strong stakeholder partnerships across programs.

Education and Experience

• Bachelor's or master's degree or equivalent experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering.

• 3-5+ years experience in Semiconductor Frontend/Backend Manufacturing, preferably minimum 1 year of HBM experience

• Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.

• Solid understanding of advanced packaging flows

• Proficiency in essential computer applications, including Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.

• Knowledge of SAP, Teamcenter and manufacturing execution systems.

• Knowledge of Project Management Tools/Systems.

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Demonstrated excellence in leading teams within a global manufacturing network composed of members from diverse fields and cultures.