Company
RF360 Singapore Pte., Ltd.
Job Area
Engineering Group, Engineering Group > Hardware Engineering
General Summary
Job Scope
- Lead wafer probing and failure analysis team in achieving product yield, output and cost effectiveness.
- Maintain effective, accurate and robust measurement procedures in wafer probing.
- Ensure smooth process flow with high quality, high yield, low cost by working with cross functional teams to achieve the overall committed targets.
- Support new technology and qualification setup.
Job Responsibilities
- Perform comprehensive wafer probing and failure analysis and report failure analyses timely.
- Work with process technician and yield engineers on effective hold lots dispositions.
- Ensure wafer prober measurement integrity and prober matching across all wafer probers.
- Analyze and reduce NTF to improve wafer prober measurement integrity.
- Design and set up proper probe cards/cores maintenance and management.
- Contribute in quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.
- Proactively drive team deployment and apply hands-on and with deep involvement at work.
- Regular reviews of OCAP, FMEA and Control Plans.
- Ensure timely update of procedures and effective implementations.
- Coach and guide process technicians in process, failure and yield analyses and product to build up their technical competencies
- Take accountability of work and possesses strong sense of responsibility
Education/Experience Requirements
- At least a Bachelor's degree in Electronic or Electrical Engineering or Material Science or equivalent.
- Fresh graduates who like hands on activities or Engineers with 1-2 years of working experience.
- Direct working experience in wafer fab process integration will be added advantage.
- Possess strong technical competencies in his field of study.
- Able to work under pressure and with strong commitment at work.
- Good knowledge of statistical and quality tools.
- Experience with software applications such as MS Power Point, Excel and Word.
Skills, Abilities & Knowledge
- Good knowledge of wafer fab manufacturing processes and capable of applying them effectively at work.
- Good yield and product analyses skills.
- Strong organizational, leadership, communications, and interpersonal skills.
- Systematic troubleshooting and problem solving skills using DMAIC, cause-and- effect, 5 Whys analysis, etc.
- Application of quality and SPC tools at work - FMEA, DOE, SPC, etc.
- Dynamic, resourceful, creative, innovative and self-driven.
- Able to multi-task, set priorities and meet deadlines
Minimum Qualifications
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
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