Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
Generate technical reports and preserve accurate engineering data for audit readiness.
Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.
Requirements
Bachelor's Degree in Engineering or a related technical discipline.
3+ years of experience within a semiconductor manufacturing environment.
