Collaborate with cross-functional teams (design, test, process, quality, manufacturing) to ensure successful product launch and manufacturability.
Drive new product introduction (NPI) activities from tape-out to release and production ramp up for automotive-grade semiconductor products.
Work closely with design team and test engineering to define test methodologies and strategies. Develop and optimize automated test equipment (ATE) test programs for coverage, quality and cost.
Oversee engineering builds, pilot runs, and manufacturing readiness.
Support product characterization, validation, and qualification activities to ensure product performance and compliance with automotive standards
Analyse product test data, yield trend, and failure rate. Identify root causes and interface with Process Engineering and suppliers (Foundries, OSATs) for actions on yield enhancement and improve product quality.
Support customer return analysis (RMA) work closely with design and failure analysis team to isolate issues for corrective actions implementation.
Qualifications
Degree in Electronics/Electrical Engineering (or relevant) with minimum seven years working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
Preferable with strong technical proficiency in product engineering for semiconductor (e.g., ASIC, SOC, RF) which include DFT, ATE platforms and test development, NPI execution and yield enhancement.
Strong problem-solving skills, results oriented and a quality-focused mindset.
Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
Team player with proactive attitude, able to work independently and travel.
