Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

As Product Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, and evaluating new equipment (highly automated and computerized) / new technology to support current and future requirement for advantage packaging technology. You will also be responsible for installation and qualification of new equipment platform and handover to production group (Equipment Maturity Index, EMI). In addition, tasks include maintaining a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platforms, collaborating with production groups on upgrades of existing production equipment through continuous improvement projects

Job Responsibilities:

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Support the evaluation and qualification of new equipment plaforms
Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
. Develop and engage creative solutions for new equipment capabilities/ solution to identified constraints or future technology requirements
. Work with equipment suppliers to develop new capabilities.
. Engage in active participation in Package Development Engineering activities . Conducts equipment benchmarking to establish equipment suppliers and platforms for future need
. Assist senior engineers in equipment benchmarking and selection activities
Evaluate and qualify new equipment platform and handover to production group
. Plan/submit capital request to acquire new Equipment
. Create and owner of purchasing specification (Doc2) document . Establish the new equipment qualification criteria and activities roadmap with respective functional teams
. Establish project handover requirements and procedures upon machine qualification
. Prepare documentation for handing over with respective site owner
. Conduct data gathering for low volume production
. Conduct training for Site representatives
. Feedback loop for Continuous Improvement after mass volume production via collaborate with production and High-Volume Manufacturing (HVM) team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform
. Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyzing the requirements to advance tool maturity level
. Maintain and regularly update the TOR, with inputs from local or other assembly site
. Maintain general knowledge of process and material characteristics and translate to equipment design requirement
. Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement
. Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
. Working with Process Control System (PCS), IT & Automation team to enable tool control systems such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, Internet of Thing (IOT), ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
. Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory Automated Material Handling System (AMHS) readiness and deployment from equipment perspective follow by working with IT & automation team to deliver full automation solution for production running support

Supplier Management & Engagement Program
. Working on several engagement forums from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
. Work with senior engineers and suppliers to support equipment improvement initiatives
. Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/bachelor's degree in electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required

• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques

• 0-2 years experience in related semiconductor industry or related manufacturing environment

• Experience with technical knowledge on assembly and/or wafer bumping and/or advanced packaging technology is a plus.

• Understanding and/or experience in equipment automation solutions is a plus

• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors

• Strong communication (verbal & written) and presentation skills (English speaking is must)

• Understanding business needs and customers requirement, able to participate in cross functional team environment

• Strong project management skills to ensure execution to timelines

• Seasonal Travel based on business need will be required

• Performs hardware, software engineering assignments as required

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality or effectiveness.

• Strong analytical, logical, and critical thinking skills

• Growth mindset with a passion for continuous learning

• Internship or experience in the semiconductor industry is a plus

• Demonstrated leadership and a track record of impact are highly desirable

• Interest in and knowledge of the semiconductor industry and Micron is preferred

• Ability to apply baseline digital fluency and roleappropriate AI literacy to use AIenabled tools responsibly and effectively for research, analysis, content creation, problemsolving, operational tasks, and achieving business outcomes.

• Inclusion & Accessibility Statement

• Micron is committed to fair, inclusive, and merit based hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.

• Successful candidates are expected to embody Micron's

Core values:

• . People - Respect, develop, and empower others
  . Innovation - Drive continuous improvement and breakthrough thinking
  . Tenacity - Demonstrate accountability and perseverance
  . Collaboration - Build trust and work as one team
  . Customer Focus - Deliver excellence and value

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.