Responsibilities:
Plating Process Engineering
- Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)
- Monitor plating bath performance through regular analysis and corrective actions
- Perform DOE, capability studies, and process qualification for new plating chemistry or equipment
- Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion
- Establish and maintain plating process parameters, SOPs, and control plans
Wet Process Support (Etching, Cleaning, Stripping)
- Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity
- Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning
- Monitor and sustain wet chemistry tanks (etchants, cleaners, developers, strippers) through SPC and scheduled chemical analysis
- Drive root-cause analysis for wet process issues including over-etch, under-etch, residue, or surface contamination
Laboratory Support
- Conduct chemical titration, CVS, TOC, and other plating bath analytical methods
- Prepare samples, test coupons, and run lab-scale plating and etching experiments
- Support failure analysis through cross-sectioning, microscopy (SEM/OM), and surface characterization
- Maintain calibration and good housekeeping of lab tools, chemical inventory, and safety compliance
Yield Improvement & Quality
- Analyze process data to identify trends and drive yield improvement actions
- Support customer audit requirements, documentation, and technical reporting
- Collaborate with Quality, Production, and R&D teams to resolve product or process quality issues
Equipment & Safety
- Support installation, preventive maintenance, and troubleshooting of plating and wet process equipment
- Ensure compliance with EHS guidelines for chemical handling, waste disposal, ventilation, and PPE usage
- Participate in safety risk assessments for chemical operations
Requirements:
- Degree in Chemical Engineering, Materials Engineering, Chemistry, or related technical field
- Experience in electroplating, Semiconductor packaging, or chemical wet processes preferred
- Knowledge of plating chemistry, solution analysis, and surface finishing technologies
- Familiarity with SPC, DOE, FMEA, and root-cause analysis tools
- Strong analytical, documentation, and problem-solving skills
- Ability to work in cleanroom or chemical processing environment
