Engineer, Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering

Key Responsibilities

• Product Disposition Solutions: Develop, validate and deploy product-disposition solutions (wormhole) to ensure quality and reduce Defects Per Million (DPM) through a comprehensive product disposition program/workflow.

• Data Analysis for Yield Improvement and Reliability: Utilize in-house statistical tools, machine learning, and AI for engineering data analysis to enhance yields and reliability, integrating these improvements within the Dispo workflow.

• Deviation Alert System: Create a deviation alert system to monitor yield loss, characteristic/parameter trends, and wafer/die/cube shading.

• Models/Algorithm Development: Develop state-of-the-art algorithms, including Machine Learning and Deep Learning models, to advance data mining and pattern recognition for quality enhancement, yield improvement, wafer/die level screening and efficiency enhancement.

• Mentorship and Development: Actively mentor and develop team members to foster growth and development within the team and the organization.

• Cross-Functional Collaboration: Work closely with various cross-functional teams, including Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams, to ensure the holistic development and successful shipping of end products.

• Promotion of Innovation: Promote innovation and drive changes that provide a technical advantage over competitors, maintaining the company's competitive edge in the market.

• AI/ML Advocate: Collaborate with cross-functional teams to develop, deploy, and validate AI/ML models aimed at enhancing key performance indicators (KPIs) such as Quality, Cost, Cycle Time, and Scale.

• AI Responsibilities:
  . Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  . Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.
  . Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes

Requirements

• Bachelor's or Master's degree in Electrical and Electronics Engineering, Statistics, or related engineering fields.

• At least 3 years of experience in data analytics or data science is preferred.

• Experience leveraging AI-enabled tools or developing AI-based solutions to solve business or technical problems.

• Prior experience in Micron Product Engineering or the semiconductor industry is a plus.

• Demonstrate strong leadership and technical skills

• Understanding of data analytics, data extraction, and analysis tools such as JMP, Tableau, and Power BI.

• Excellent communication skills to present findings and insights to non-technical stakeholders.

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Experience in mentoring and coaching team members to develop their skills.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Work on site in Singapore with international travel to Taiwan.