Engineer CE PYE

Main Responsibilities

• Perform electrical device characterization, fault isolation, and physical failure analysis to identify failure mechanisms and defect locations.

• Analyze electrical and physical failure data to determine root causes, classify defects, and support yield and reliability improvement initiatives.

• Collaborate with Product Engineering, Process Integration, Test, Manufacturing, and Quality teams to resolve defectivity and product reliability issues.

• Prepare and present technical findings, defect analysis results, and failure mechanism reviews to support data-driven decision-making.

• Support the development, qualification, and adoption of advanced fault isolation and failure analysis techniques to enhance diagnostic capability.

• Maintain the readiness, utilization, and operational effectiveness of fault isolation and failure analysis equipment.

Other Responsibilities

• Document experiments, analysis results, and technical learnings in accordance with organizational standards.

• Support continuous improvement initiatives for defect reduction, yield enhancement, and operational efficiency.

• Contribute to knowledge sharing and best-practice development within the failure analysis function.

AI Responsibilities

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Qualifications

• B.Sc. or higher in Electrical Engineering, Electronic Engineering, Materials Science or equivalent.

• Experience in semiconductor failure analysis, fault isolation, test engineering, product engineering, yield engineering, or related discipline is preferred.

• Knowledge of memory technologies such as NAND, DRAM, or HBM is advantageous.

Technical Skills

• Electrical fault isolation methods, device characterization, and failure mechanism analysis.

• Physical failure analysis techniques and defect characterization methodologies.

• Root cause analysis, yield improvement, and structured problem-solving approaches.

• Data analysis, statistical interpretation, and familiarity with AI-enabled or data-driven engineering analysis tools.

Soft Skills

• Structured analytical problem-solving.

• Clear technical communication and presentation skills.

• Cross-functional collaboration and stakeholder engagement.

• Disciplined execution and attention to detail.

• Learning agility and continuous improvement mindset.

Preferred Skills

• Hands-on experience with advanced fault isolation and physical failure analysis tools.

• Exposure to AI, machine learning, or advanced analytics applications in semiconductor engineering environments.

Embody Micron's Core Values

• People - Respect, develop, and empower others

• Innovation - Drive continuous improvement and breakthrough thinking

• Tenacity - Show grit and determination

• Collaboration - Build trust and foster teamwork

• Customer Focus - Deliver excellence and value

• Speed - Act with purpose and set the pace