Perform sample preparation (parallel lapping, IC delayering, chemical decapsulation), FIB and other preparation techniques
Perform failure analysis using various tools and instruments such as CSAM, SEM/EDX, 2D/3D X-ray, Thermal Emission and OBIRCH/PEM
Communicate with customer for selecting proper analytical technique and data interpretation
Prepare analytical reports
Document new failure analysis operating procedures, training and certification specs
Participate/assist in new failure analysis techniques development
Perform routine instrument preventive maintenance and laboratory housekeeping
Job Requirements:
At least Bachelor's Degree in Electrical or Electronic Engineering, Materials Science Engineering, or Science & Technology, with a minimum of 2 years of relevant working experience.
Must be able to perform FA study individually and work well in teams
Maintain good 6S practice during daily operation
Experience with Thermal Emission/OBIRCH/TIVA/PEM would be preferred
Experience in other FA techniques including: Sample preparation (parallel lapping, IC delayering, chemical decapsulation), CSAM, X-Ray, SEM and FIB would be a bonus
Experience in Wafer Fab/Semiconductor/LED/Solar/HDD industries would be useful
A team player who can be independent, hardworking with a persevering attitude.
