[Job ID: 1615593]
Job Summary
Lead end-to-end electrical system design for advanced semiconductor packaging equipment, driving performance, compliance, and product excellence.
Responsibilities
- Lead electrical system architecture design for advanced packaging equipment.
- Develop system-level designs encompassing motion control, power distribution, sensors, and interconnects.
- Collaborate closely with mechanical, software, and process engineering teams to optimise overall system performance.
- Provide technical leadership, including mentoring engineers and conducting design and technical reviews.
- Own the full product lifecycle from concept development through production and sustaining support.
- Ensure designs comply with relevant CE, SEMI, and IEC standards.
- Drive design-for-cost, manufacturability, reliability, and on-time project delivery.
Requirements
- At least Masters Degree in electrical and electronic engineering or mechatronics or electro-mechanical engineering.
- At least 5 years of professional experience in semiconductor equipment, precision automation, or related industries.
- Strong expertise in motion control systems, sensors, power electronics, and EMI/EMC design principles.
- Experience with advanced packaging equipment is an added advantage.
- Proficiency in CAD/CAE tools such as PADS, AutoCAD, and SolidEdge, as well as MATLAB/Simulink.
- Demonstrated leadership capability with strong analytical, problem-solving, and communication skills.
- Ability to collaborate effectively with cross-functional teams in a fast-paced engineering environment.
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EA Personnel Name: Zoe Lang Zhen Zhen
EA Personnel Registration Number: R23117353
EA License No.: 07C5771
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