Director of Etch Module

Role Overview

We are seeking an experienced Director of Etch Module Engineering to lead the Etch engineering organization within a high-volume 300mm semiconductor manufacturing environment. This role is responsible for driving process excellence, yield improvement, technology transfer, operational performance, and team development across Etch processes. The successful candidate will work closely with Process Integration, Manufacturing, Equipment Engineering, Yield, Quality, and R&D to support advanced semiconductor technologies and manufacturing objectives.

Key Responsibilities

• Lead the Etch Module Engineering organization supporting high-volume 300mm wafer manufacturing.
• Drive process optimization, yield enhancement, defect reduction, and manufacturing productivity.
• Develop and execute module strategies to achieve yield, quality, cost, and cycle time targets.
• Lead new technology development, qualification, and transfer into high-volume production.
• Partner with Process Integration to optimize device performance and process capability.
• Establish advanced process control strategies using SPC, DOE, FDC, APC, and statistical analysis.
• Lead root cause analysis and corrective actions for process excursions and yield loss.
• Collaborate with Equipment Engineering to improve tool reliability, uptime, and Overall Equipment Effectiveness (OEE).
• Manage engineering resources, budgets, and capital equipment planning.
• Recruit, mentor, and develop engineering managers and technical talent.
• Drive cross-functional collaboration to support technology roadmap execution and manufacturing excellence.
• Ensure compliance with safety, quality, and environmental standards.

Ideal Requirements

• Bachelor's degree in Engineering, Materials Science, Physics, Chemical Engineering, or a related discipline. Master's or PhD is preferred.
• 15+ years of semiconductor manufacturing experience, including extensive experience in a 300mm wafer fabrication environment.
• Strong expertise in Dry Etch processes, including dielectric etch, conductor/metal etch, silicon etch, plasma etch, reactive ion etching (RIE), and advanced pattern transfer.
• Proven experience in Etch process development, yield improvement, defect reduction, process integration, and high-volume manufacturing.
• Strong knowledge of SPC, DOE, FDC, APC, statistical analysis, and structured root cause problem-solving methodologies.
• Demonstrated leadership experience managing engineering managers and multidisciplinary technical teams.
• Experience leading technology transfers, process qualifications, and advanced node production ramp-ups.
• Excellent leadership, communication, stakeholder management, and decision-making skills.
• Ability to lead cross-functional teams in a fast-paced, high-volume semiconductor manufacturing environment.

If you would like to be considered for this opportunity, please forward a copy of your full CV to [Confidential Information]

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614