Director of CMP Module

Role Overview

We are seeking an experienced Director of CMP Module Engineering to lead the Chemical Mechanical Planarization (CMP) engineering organization within a high-volume 300mm semiconductor manufacturing environment. This role is responsible for driving process excellence, yield improvement, technology transfer, operational performance, and organizational development across CMP processes. The successful candidate will collaborate closely with Process Integration, Manufacturing, Equipment Engineering, Yield, Quality, and R&D to support advanced semiconductor technologies.

Key Responsibilities

• Lead the CMP Module Engineering organization supporting high-volume 300mm wafer manufacturing.
• Drive process optimization, yield enhancement, defect reduction, and productivity improvements across CMP operations.
• Develop and execute module strategies to achieve manufacturing, quality, cost, and cycle time targets.
• Lead new technology development, qualification, and transfer into volume production.
• Partner with Process Integration to optimize device performance and manufacturing robustness.
• Establish process control methodologies using SPC, DOE, FDC, APC, and statistical analysis.
• Lead root cause investigations and implement corrective actions for process excursions and yield issues.
• Collaborate with Equipment Engineering to improve tool reliability, uptime, and overall equipment effectiveness (OEE).
• Manage engineering resources, budgets, and capital equipment planning.
• Build, coach, and develop a high-performing engineering organization.
• Drive cross-functional collaboration to support manufacturing excellence and technology roadmaps.
• Ensure compliance with safety, quality, and environmental standards.

Ideal Requirements

• Bachelor's degree in Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline. Master's or PhD is preferred.
• 15+ years of semiconductor manufacturing experience, including significant experience in a 300mm wafer fabrication environment.
• Strong expertise in CMP processes, including oxide CMP, tungsten (W) CMP, copper (Cu) CMP, STI CMP, dielectric CMP, and post-CMP cleaning.
• Proven experience in CMP process development, yield improvement, defect reduction, and process integration.
• Strong knowledge of statistical process control (SPC), Design of Experiments (DOE), FDC, APC, and root cause analysis methodologies.
• Demonstrated leadership experience managing engineering managers and multidisciplinary technical teams.
• Experience leading technology transfers, process qualifications, and high-volume production ramp-ups.
• Excellent leadership, communication, stakeholder management, and problem-solving skills.
• Ability to thrive in a fast-paced, high-volume semiconductor manufacturing environment and collaborate effectively with global cross-functional teams.

If you would like to be considered for this opportunity, please forward a copy of your full CV to [Confidential Information]

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614