Bond Equipment Engineer ( Photo )

Job Description:

• As an Equipment Owner able to evaluates, selects, and make justification for equipment that is most appropriate and cost effective for the manufacture of company products.
• Oversees the installation, modification, upgrade, and maintenance of manufacturing equipment.
• Liaise with vendors to resolve equipment issues and manage/drive vendors performance to meet/exceed equipment KPI, MTTR, MTBF and goals.
• Establishes projects and solutions for increasing uptime, throughput, cost saving and resolve equipment problems that affect the manufacturing process.
• Ability to review Process SPC data, setup equipment FDC and machine control and Improve alarm reduction
• Provides technical support to the manufacturing equipment repair and process engineering organizations.
• Defines and writes preventative maintenance procedures and schedules.
• Conduct training to shift members (PM operator, Technician & Engineers).
• Able to coach shift engineer in performing hardware trouble shooting, generate troubleshoot lesson learnt material and equipment OCAP for sharing with Team

Job Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• 2 or more years of semiconductor equipment or process engineering experience preferably Wafer bonder and Sam coat machines
• Develop ,implement and sustain preventive & predictive maintenance strategies to maximize uptime and performance
• Execute equipment upgrades and minor hardware modifications to improve tool capability and reliability & operational efficiency
• Willing to learn and adopt & Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems & address root causes
• Perform Normal/ Swing Shift ( or 12-hour rotating shift if required)
• Good interpersonal skills and is an excellent team player
• Good verbal and written communication skills
• Logical thinking capability and good analytical skill