Perform loading and analysis on IC packages using FA / Reliability tools and equipment.
Support physical failure analysis such as parallel cross-sectioning on wafer level chip size package.
Perform basic failure analysis on electrical rejects from low yield and engineering lots.
Generate and finalize FA Report based on the FA procedure done.
Requirements
Diploma in Engineering, preferably in Electrical/ Electronics or equivalent.
Knowledgeable on basic FA equipment and techniques like Curve Tracer, X-ray, CSAM, SEM, decapsulation, cross-section, fault isolation, parallel polishing, warpage measurements, etc.
English proficient and knowledgeable in technical report writing (FA Report).
