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PEOPLE PROFILERS PTE. LTD.

AOI Process Senior/Engineer

Early Applicant
  • Posted 12 days ago
  • Be among the first 10 applicants
3-5 Years
SGD 4,000 - 6,900 per month

Job Description

Summary

To develop and optimize AOI and reflow process technologies to ensure stable mass production and high product quality in advanced packaging lines, and to support customer and internal quality requirements.

Job

. Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes

. Operate and optimize 2D/3D AOI systems and inspection parameters

. Configure AOI inspection algorithms for new product designs

. Set up process conditions and equipment configurations for new packages and production lines

. Optimize reflow parameters and temperature profiles

. Analyze solder/micro bump quality and implement improvements

. Conduct root cause analysis and implement corrective actions for process issues

. Support customer quality requirements through technical evaluation and documentation

. Supports mass production and quality control in the advanced semiconductor packaging process

. Contributes to defect reduction, process stability, and customer satisfaction

. Drives yield and reliability improvements in AOI and reflow process areas

Requirement:

. Bachelor's degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)

. Minimum 3 years of experience in AOI or reflow process in semiconductor backend

. Ability to establish process conditions and optimize parameters

. Strong data analysis and problem-solving skills

. Experience in defect analysis and developing defect evaluation criteria

. Basic understanding of thermal, electrical, and material behavior in reflow processes

. Experience in advanced packaging process such as 2.5D, fan-out and flip-chip

. Familiarity with quality tools such as APQP, FMEA and 8D methodology

. Collaborative experience in AOI image analysis and algorithm development

. Understanding of associated assembly/joining processes (eg. Bonding, chip attach)

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to stating

1) Current Drawn

2) Expecting Salary

3) Date Available

4) Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 5WV9W6W5

People Profilers Pte Ltd (People Profilers) has entered into a Partnership Recruitment Collaboration with Employment and Employability Institute Pte Ltd (e2i), to extend the support of hiring beyond e2i's resources to broaden the reach of jobseekers.

This is in partnership with the Employment and Employability Institute Pte Ltd (e2i).

e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives. By applying for this role, you consent to People Profilers's PDPA and ().

More Info

Industry:Other

Function:Semiconductor

Job Type:Permanent Job

Date Posted: 18/09/2025

Job ID: 126318825

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Last Updated: 28-09-2025 08:05:16 PM
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