Advanced Packaging Design Lead

Global Semiconductor Organisation
Advanced Packaging Design Lead
Singapore | Regional Relocation Opportunity

Our client is a leading semiconductor organisation driving innovation in advanced packaging technologies. As part of its continued growth, it is seeking an Advanced Packaging Design Lead to join its engineering team and play a key role in developing next-generation packaging solutions for high-performance semiconductor applications.

Role

You will lead package design activities across advanced packaging technologies, including wafer-level and substrate-based platforms. Working closely with cross-functional engineering teams and customers, you will be responsible for package layout, routing, design reviews, tooling development, design risk assessments, and continuous improvement of design methodologies to support new product introduction and manufacturing.

Requirements

Degree qualified in Electronics, Electrical Engineering or a related discipline, you possess extensive experience in advanced semiconductor packaging gained within an OSAT, IDM, foundry, or similar environment. You have strong expertise in technologies such as WLCSP, wafer bumping, BGA, substrate packaging, fan-out/eWLB, or related advanced packaging platforms, together with hands-on proficiency in Cadence APD and associated package design tools. Candidates with a passion for technical excellence and experience leading complex package design projects are encouraged to apply.

Regional and international candidates who are open to relocating to Singapore are welcome to apply.

To Apply

To apply, please submit your resume to Tahmid Bin Zafar at [Confidential Information], quoting the job title and reference number 36089.

We regret that only shortlisted applicants will be contacted.

Licence No.: 16S8060
Registration No.: R1439740

Desired Skills and Experience

Degree qualified in Electronics, Electrical Engineering
Extensive experience in advanced semiconductor packaging