Process Control, wet etch behavior, Root Cause Analysis

adhesive epoxy or other bonding material, active alignment process optics bonding equipment, quantitative measurement methodology, optics alignment process, design of experiment, camera module process development, Root Cause Analysis, engineering statistic, metrology tools, camera active alignment process development, image and optical test

Solidworks, Matlab, Python, Spc, Autocad, 8D, Six Sigma, dispensing and pick place process, Jmp, Statistical Process Control methodologies, Minitab, data analysis packages, Doe

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans