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Skills:
Agentic AI workflows, probe and test methodologies, Supplier Management, process control statistics, process integration, defect analysis, solid-state device physics, semiconductor metrology, Hardware, NAND DRAM integration, semiconductor process development optimization
Skills:
cmp , lithography, diffusion, Wet etch, Plasma Dry Etch Technology, High aspect ratio etch development, process integration, cvd, Metals
