pareto charts , Verification And Validation, Solidworks, BOM Structuring, Altium Designer, Cause and Effect, Control Charts, 8D, Failure Analysis, Yield Reporting, Engineering Change Process Management, DFX, Dfmea, PCBA Design, Mechanical Engineering, Doe, Electrical and Electronics Engineering

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

Tolerance Stack-up Analysis, Mechanical FEA, Mechatronics Engineering, Mechanical Engineering