Yield Reporting, Engineering Change Process Management, DFX, Dfmea, PCBA Design, Mechanical Engineering, Doe, Failure Analysis, Electrical and Electronics Engineering

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

MATLAB, Python, LabVIEW, Root Cause Analysis, laser optics, Optical Product Design, Optical DFMEA, Zemax OpticStudio, Thin-Film Filters, Fluorescence Detection, Optical Simulation Software, optical system design