Role Summary:

The Advanced Packaging Development Process Engineer will develop and qualify wafer singulation technologies for next-generation HBM and advanced packaging products.

This position will lead dicing, thinning, and die separation process development, working closely with cross-functional teams, equipment suppliers, and material partners to enable future packaging technologies and manufacturing readiness.

Main Responsibilities:

Develop and optimize advanced wafer singulation technologies, including blade dicing, laser grooving, stealth dicing, laser full-cut, plasma dicing, and die separation.

Support wafer thinning, grinding, mounting, and handling processes for advanced packaging applications.

Design and execute DOE plans to improve yield, quality, and process capability.

Evaluate and qualify new dicing equipment, tooling, and materials.

Conduct process characterization, defect analysis, and root-cause investigations using statistical methods.

Drive yield improvement and process troubleshooting using structured problem-solving methodologies (KT, 5-Why, 8D).

Collaborate with Process Integration, Reliability, Equipment, and Manufacturing teams to enable technology development and transfer to production.

Monitor process health using SPC, FDC, JMP, and data analytics tools.

Partner with external suppliers to co-develop equipment and materials for future technology nodes.

AI Responsibilities:

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Candidate Profile
Minimum Required Qualifications:

PhD with ≥3 years or Master's degree with ≥5 years, or Bachelor's degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.

Demonstrated expertise in semiconductor process development, assembly, advanced packaging, or wafer processing.

Must Have Technical Skills:

Hands-on experience in wafer dicing, die separation, wafer thinning/grinding, or advanced packaging technologies.

Strong knowledge of DOE, SPC, JMP, and data analysis.

Proven problem-solving skills and experience in process optimization.

Strong communication skills and ability to work effectively in cross-functional global teams.

Must Have Soft Skills:

Strong analytical and problem-solving capabilities.

Outstanding communication, leadership, and stakeholder management skills.

Ability to work independently and collaboratively in a fast-paced environment.

Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron's core values:

People - Respect, develop, and empower others

Innovation - Drive continuous improvement and breakthrough thinking

Tenacity - Show grit and determination

Collaboration - Build trust and foster teamwork

Customer Focus - Deliver excellence and value

Speed - Act with purpose and set the pace

Principal/Staff Advanced Packaging Development Process Engineer