SAP, iso standards, Minitab, Fmea, lean six sigma methodologies, Statistical Tools, Spc, Doe, Jmp

statistical data analysis , Visual Basic, structured problem-solving, process capability improvement, Fmea, Process Alignment, Spc, Jmp, yield enhancement, risk analysis tools, statistical analysis tools, Continuous Improvement, wafer manufacturing processes, Troubleshooting, Doe

statistical data analysis , Fmea, wafer manufacturing processes, Fishbone, Doe, structured problem-solving methodologies, 8D

thermal oxidation , diffusion, thin film deposition, Fmea, wafer thinning, process control plans, OCAP execution, SPC strategies, metal passivation, implantation, statistical data analysis tools, DOE methodologies

lean tools , Microsoft Excel, LSW, Rca, 6-Sigma Green Belt

ocap, encapsulation, CQM, ISO14001 2004, wire bond, Fmea, Spc, ESEC ASM KNS wire bonders, IC assembly processes, ISO9001 2000, structural substrates, testing machinery, encapsulant epoxy, die attach, material science of bonding wires, Doe, JEDEC, QEMS

Molding, Spc, Npi, Process Planning, Cost Estimation, Programming CNC milling machines, Grinding, Production Lead-Time, Feasibility Studies, Liaise With Technical Teams, Heat Treatment, Technical Presentations, Liaising with cross functional teams, New Product Introduction, Mechanical Engineering, Ndt

statistical data analysis , metal passivation, diffusion, thin film deposition, implantation, Fmea, wafer thinning, Spc, Doe

SFC control processes, SAP process maintenance, Continuous improvement projects, Kaizen activities

Microsoft Office, Kaizen, Cost Reduction, Productivity Improvement, Lean Manufacturing, Autocad, Pfmea, Six Sigma, QCP, process validation per ISO 13485, Yield Improvement