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Semiconductor Advanced Packaging Mechanical Design Engineer ( TCB / Flip-Chip ) - YZ11

the supreme hr advisory pte. ltd.
T
Shenton Way, Singapore

Skills:

tolerance analysis , Structural Analysis, DFA, Fea, Cost Reduction, Dfm, Thermal simulation, Precision motion, Pneumatics, vacuum systems, Mechanical Design, Engineering change control, Force control, Cleanroom-compatible equipment

Early Applicant
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