The project manager is coordinating mainly hardware and software related projects with the focus on a continuous improvement of Die bonder machines especially in context with performance improvement, cost reduction and functionality enhancement.
In his function is managing projects and sub projects according to the Die Attach Product Innovation Process (DAPI) by considering of proven methods, risk management and standards (Semi S2, Semi S8, CE).
Responsible for project planning and periodical controlling of targets, risks, milestones, costs and resources. In addition performs project & review meetings and creates periodical reports for the steering committee and other stakeholders involved in the project.
coordinating the information flow within the project, to the project owner, to external participants and to the production sites in Asia.
In role as sub project manager is the interface for project coordination between the different Rnd locations within Die Attach and also responsible for the series introduction of projects started from other Rnd sites.
Education
Minimal bachelor degree from Mechatronic, Electrical or Automation.
Work experience
Minimum 2 years work experience, prefer in semiconductor back end with experience in project management.
Expertise and methodology
Innovative
Self-employed and assertive
Flexible
Systematic and focused
Good presentation and communication skills
Motivator and team player
Knowledge, experience and practice on ESG initiatives is an added nice

Goel Navneet License No.: 02C3423 Personnel Registration No.: R1982194

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R&D Project Manager | Semicon

R&D Project Manager | Semicon