Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry's broadest portfolio of memory solutions-starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU's for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.
Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts
Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications
Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions
Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes
Incorporate best known manufacturing methods into early development phase of upcoming nodes
Design and implement advanced process monitoring and control methodologies
Provide strategic roadmap for N+, N++ and future NAND Nodes
Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment
Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction
Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers
This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems
Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions
As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
Strong collaboration and communication skills (verbal and written).
Self-driven, adaptable, and able to manage multiple projects.
Proven ability to take calculated risks and execute novel solutions.
Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

Staff/Principal Engineer - CMP Advanced NAND