Statistical Analysis, OPC development, advanced process control methodologies, polarized illumination, process window analysis, photolithography processes, Doe, low k1 imaging, Simulation Software, Optics, reticle layout, immersion lithography, material characterization, lithography simulation tools, overlay optimization

Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, Warpage characterization, System-in-Package SiP, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans