process integration, Defect source fingerprinting, Data Analysis, Design rule development, Project management, Continuous improvement plans, Module characterization

NAND technology, Data Analysis, Project management, device physics, process integration, CMOS device technology

Spc, Doe, wafer dicing operations, process control documentation, yield improvement methodologies, Root Cause Analysis

APQP, advanced statistical methods, Fmea, Ppap, Spc, Msa

spectrometer , Doe, optical design, Iso 9001, Analytical Instrument Manufacturing, Engineering Change Process, AA and ICP-OES Optical System Design, Six Sigma, Lean Manufacturing