C, test automation, MATLAB, Microsoft Excel, Scripting, Python, LabVIEW, Data Analysis, Statistical Tools, Jmp, FPGA design and development, optoelectronic testing, optical test equipment

3d packaging , process qualification , thermal management , vision systems, failure analysis workflows, yield analysis, semiconductor process characterization, 2.5D Packaging, Flip Chip, Spc, CoPoS, CoWoS, Advanced Packaging, HBM, statistical analysis tools, Chiplet Integration, Doe, alignment systems, warpage control