Responsibilities:

Define requirements and features for Back-end semiconductor equipment.
Develop and improve the concepts/architecture of new equipment.
Design mechanical systems which involve the selection and use of motors, actuators, gear drives, pumps, and valves.
Produce detailed engineering drawings.
Perform design verification and validation testing to ensure compliance with specifications, safety regulations, and product requirements.
Application of analysis tools like Fish Bone Diagram, FMEA, DOE, etc.

Requirements:

Degree in Mechanical or Mechatronics Engineering with minimum of 5 years of experience in automation design.
Good knowledge and experience in the design of Automation or semiconductor equipment, High precision machine design, or Design of High-Speed Pick and Place mechanisms.
Proficient with 3D CAD software and performing Equipment troubleshooting.
Able to produce detailed Mechanical drawings and apply knowledge of Geometric Dimensioning & Tolerancing.
Ability to work independently with high level of motivation and communicate with all levels.
Able to travel overseas for field support when required.

To find out moreabout this opportunity, please contact LionelLiew at [HIDDEN TEXT].

We regret that only shortlisted candidateswill be notified.

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793| EA Personnel: LionelLiew | Registration No: R1330693

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Mechanical Design Engineer (Semiconductor Assembly)