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Singapore

Skills:

manufacturing processes thermal management PrototypingInjection MoldingFinite Element MethodsDesign for manufacturabilityNew Product DevelopmentMachiningAnsys Simulation SoftwareSheet MetalMechanical SystemsMolded pulp packaging structuresPackaging processesSolidWorks CADProduction tooling3D CAD toolsPTC Creo CAD SuiteComputer-Aided DesignMechanical DesignProduct Lifecycle ManagementProduct DesignMechanical Engineering

Early Applicant
Singapore

Skills:

wafer level packaging process flowMCM package signal power integrityinterconnect schematic and layout designstatistical analysis toolshybrid integration packaging designMCM package mechanical drawingoptical package development

Early Applicant
Singapore

Skills:

altium ExcelPythonHspiceData Analysispackaging technologyAllegro PCBsignal power integrity simulationJmpSpectreAdsSiwaveEDA ToolsAPDsubstrate designSigrityhfss

Early Applicant
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