School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built on a culture of excellence, the School is renowned for its high academic standards and research. With over 3,000 undergraduates students and 2,000 graduate students it is one of the largest EEE schools in the world and ranks 4th in the field of Electrical & Electronic Engineering in the 2025 QS World University Rankings by Subjects.

Today, the School has become one of the world's largest engineering schools that nurtures competent engineers and researchers. Each year, the School graduates over a thousand students who are ready to take on great ambitions and challenges.

For more details, please view: https://www.ntu.edu.sg/eee

We seek a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding for fine-pitch, high-density interconnects by developing and validating a new flow with reliable dielectric sealing under ≤200 °C. The role integrates materials selection, wafer-level process development, and reliability demonstration to deliver a manufacturable 3D-integration solution that supports NTU's leadership in industry-relevant advanced packaging research.

Key Responsibilities:

Develop and run a Cu-Cu hybrid bonding flow for fine-pitch 3D integration.
Optimize process windows (pressure/temperature/anneal/surface activation) to minimize contact resistance and voids maintain cleanroom/tool best practices.
Characterize materials and interfaces using optical/profilometry, SEM/TEM, surface chemistry, and electrical IV translate data into process improvements.
Validate reliability and scalability via thermal cycling/HTS/electrical stress on test vehicles build prototype stacks (e.g., interposer/test-chip) to evidence manufacturability.
Report and collaborate: produce clear technical reports/presentations, coordinate with partners, and maintain rigorous documentation, version control, and safety compliance.

Job Requirements:

PhD in Materials/ Microelectronics/ EEE/ or related.
Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid bonding litho/etch/CMP/plasma/anneal).
Characterization: optical/profilometry, SEM/TEM, XPS/AFM, electrical probing DoE/statistics (Python/Matlab a plus).
Strong documentation, safety discipline, and clear communication in English.
Process integration & optimization root-cause/failure analysis.
Reliability mindset (design/interpret thermal & electrical stress tests).
Collaboration with tool vendors/industry partners concise reporting ownership.

We regret to inform you that only shortlisted candidates will be notified.

Research Fellow (Semiconductor Advanced Packaging)