Responsibilities

Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
Support component-, board-, enclosure-, and sub-system–level thermal analysis for electronic products
Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
Apply appropriate boundary conditions, material properties, and solver settings under guidance from senior engineers
Support steady-state and transient thermal analyses, including power ramp-up, duty cycles, and basic fault scenarios
Post-process and interpret simulation results to identify thermal risks, airflow issues, and design improvement opportunities
Assist in correlating simulation results with experimental data, lab measurements, or field observations
Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
Support verification and validation (V&V) activities by following defined modeling and review processes
Engage with senior engineers to understand UL safety considerations, certification objectives, and modeling expectations
Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
Collaborate effectively with cross-functional teams and contribute to a learning-oriented, supportive team culture

Qualifications

Bachelor's or Master's degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or a related field from a reputed institution
2–5 years of industrial or applied experience in Computational Fluid Dynamic (CFD) and thermal-fluid simulations (internships and thesis work may be considered)
Strong fundamentals in: Fluid mechanics and basic turbulence modeling, Heat transfer (conduction, convection, radiation), Thermodynamics relevant to electronics cooling,
Hands-on exposure to CFD model setup, solution execution, and result interpretation
Familiarity with at least one commercial simulation tool such as: ANSYS Icepak, ANSYS Fluent, FLOTHERM, FLOEFD, STAR-CCM+, COMSOL, or similar software
Basic understanding of: Mesh generation and grid quality concepts, Solver settings and convergence behavior, Ability to follow structured modeling workflows and technical guidelines
Good written and verbal communication skills, with ability to explain results clearly
Self-motivated, detail-oriented, and comfortable learning in a technically rigorous environment
Exposure to electronics thermal management, including ICs, PCBs, heat sinks, fans, vents, and enclosures
Awareness of electronics packaging constraints (space, airflow resistance, materials, power dissipation)
Basic experience with thermal testing, such as thermocouple placement, temperature measurement, or data acquisition
Introductory experience correlating simulation results with test or experimental data
Familiarity with transient thermal behavior and power cycling effects
Interest in automation, scripting, or AI-assisted simulation workflows

About Us

A global leader in applied safety science, UL Solutions (NYSE: ULS) transforms safety, security and sustainability challenges into opportunities for customers in more than 110 countries. UL Solutions delivers testing, inspection and certification services, together with software products and advisory offerings, that support our customers product innovation and business growth. The UL Mark serves as a recognized symbol of trust in our customers products and reflects an unwavering commitment to advancing our safety mission. We help our customers innovate, launch new products and services, navigate global markets and complex supply chains, and grow sustainably and responsibly into the future. Our science is your advantage.

Associate AI / Simulation Engineer, Thermal/CFD