Key responsibilities and duties include:

Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking
Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity
Establish and improve equipment management projects to deliver tech node requirements
Evaluate and promote new equipment and materials to enhance process capabilities
Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing
Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products. cost, availability, and improve hardware and process capability
Ensure defense coverage through process, measurement, inspection, and testing
Establish correlations between defense mechanisms to identify improvement opportunities
Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team
Good knowledge of Wafer Fab Manufacturing system, eg: MES, ETO, Autoshell and E3 FDC is preferred
Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area
Collaborating with process development teams to develop innovative new solutions.
Performing fundamental research to drive innovative solutions for next-generation equipment products.
Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production
Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence

Education and Experience:

B.S/M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder
Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred
Experience with Visual Basic for automation and tool integration.
Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding
Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware
Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure
Knowledge of semiconductor processing, solid-state device physics desirable
Consistent track record to solve problems and address root causes

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Snr/Staff Equipment Development Engineer (APTD)