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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As Front End Central Product Integration Engineer-Chip Package Interaction at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity.

Responsibilities And Tasks

Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.
Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.
Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.
Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.
Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field
A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required
Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%
Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.
The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.
Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.
Good multi-tasking, verbal, and written communication skills.
Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
Good organizational capabilities and ability to work effectively with minimal supervision.
Intermediate to advanced PC skills including Microsoft Office.
Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [HIDDEN TEXT]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Front End Central Product Integration - Chip Interaction Senior Engineer/Engineer